Product
VTC-600-2HD DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater
basic information
|
Model：
|
VTC-600-2HD DC/RF Dual-Head High Vacuum 2” Magnetron Plasma Sputtering Coater | |
|
Brief Introduction：
|
VTC-600-2HD is a magnetron sputtering system featuring dual target sources: 1) DC source for coating metallic material on one head and 2) RF source for coating non-metallic material on the other head. It is equipped with a film thickness tracker to enable the user to easily monitor the coating progress and also record the data. This model is sophsticatedly designed for coating single or multiple film layers of a wide range of substrate materials (ferroelectric, condutive, alloy, semiconductor, ceramic, dielectric, optical, oxide, hard, PTFE and etc). Its compactness and ease of operation make it an ideal coating system for use in R&D labs. |
|
|
Technical Parameter：
|
Input Power
|
220VAC 50/60Hz, single phase |
| 2000W (including pump) | ||
|
Source Power
|
Two sputtering power sources are integrated into one control box | |
| DC source: 500W for coating metallic materials | ||
| RF source: 600W with automatching for coating non-metallic materials | ||
| Compact 300 RF source is available at extra cost | ||
|
Magnetron Sputtering Head
|
Two 2" Magnetron Sputtering Heads with water cooling jackets are included ( click picture-left to see detailed specs ) | |
| One is connected to RF power supply for no-conductive materials | ||
| Another is connected to DC sputtering power source for coating metallic materials | ||
| Target size requirement: 2" diameter | ||
| 1/16" max. thickness for metallic targets | ||
| 1/4" max. thickness for no-conductive targets | ||
| One stainless steel and one Al2O3 ceramic targets are included for demo testing | ||
| Head Water Cooling: 10ml/min water flow required, and one 16ml/min digitally controlled recirculating water chiller is included for cooling both magnetron sputtering heads | ||
| Customized coater: two RF head without DC sputering, 3 RF head are available upon request | ||
|
Vacuum Chamber
|
Sample holder size: 140mm dia. for. 4" wafer max | |
| Sample holder rotation speed is adjustable: 1 - 20 rpm for uniform coating | ||
| The holder temperature is adjustable from RT to 500°C Max with accuracy +/- 1.0 °C | ||
|
Gas Flow Control
|
Two precision digital MFC (mass flow controller) are installed to allow two types of gases to be filled in | |
| Flow rate: 200 ml/min max. | ||
| Flow rate is adjustable on the 6" touch screen control panel | ||
|
Vacuum Pump Station
|
High speed turbo vacuum pump system (made in Germany) is directly installed on the vacuum chamber for max. vacuum level | |
| Heavy duty dual stage mechanical pump is connected to turbo pump for faster pump speed | ||
| Mobile pump station is included and the compact sputtering coater can be put on top of station | ||
| Max. vacuum level: 10^-6 torr with chamber baking | ||
|
Thickness Monitor
|
One Precision quartz thickness sensor is built into the chamber to monitor coating thickness with accuracy 0.10 Å | |
| LED Display Unit outside chamber can: | ||
| Input material to be coated according to data base included | ||
| Display total thickness coated and coating speed | ||
| 5 pcs quartz sensors (consumable) are included | ||
| Water cooling is required | ||
|
Water Chiller
|
One digital temperature controlled recirculating water chiller is included. Refrigeration range: 5~35 °C Flow rate: 16 L/min Pump pressure: 14 psi |
|
|
Overall Dimensions
|
L1300mm× W660mm× H1200mm | |
|
Net Weight
|
160 kg | |
|
Warranty
|
One years limited warranty with lifetime support | |
The next article
STX-1202-Precision Wire Saw with Sample Stage