Product
Cold inlay
Scope of application: Suitable for metal processing industry that cannot be heated or inlaid
Hot inlay resin: The cold inlay is directly placed into the silicone or plastic mold, and the resin is cured at room temperature to obtain the inlaid sample. The cold inlaid resin can be dosed according to the demand and injected in the specified time. Inlay mold, batch sample preparation, suitable for the inlay of heat-sensitive and pressure-sensitive materials; cold inlay does not require special inlay equipment, the necessary configuration container and mosaic mold can complete the inlay process
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Name |
Model |
Description |
Package |
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Acrylic systm |
LYK-A/B |
The product cures quickly, is translucent, does not require heating, does not require pressure, and is suitable for metal processing industries that cannot be heated or inlaid. Curing time: 20~25 minutes Use ratio: powder 10: liquid 8 |
Cold setting powder (LYK-A) 1000g/bottle, curing agent (LYK-B) 800ml/bottle, Ф30 cold inlay mold 1, 1 syringe, 20 plastic cups, 40 stirring rods, 1 spoon |
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LYB-A/B |
The product has high flashing, high permeability, excellent toughness, no need for heating, no need for pressurization, and is suitable for metal processing industry that cannot be heated or inlaid. Curing time: 10~15 minutes Use ratio: powder 1: liquid 1 |
Cold setting powder (LYB-A) 1000g/bottle, curing agent (LYB-B) 800ml/bottle, Ф30 cold inlay mold 1, 1 syringe, 20 plastic cups, 40 stirring rods, 1 spoon |
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LYS-A/B |
The product has high flashing, high permeability, excellent toughness, no need for heating, no need for pressurization, and is suitable for metal processing industry that cannot be heated or inlaid. Curing time: 10~15 minutes Use ratio: powder 1: liquid 1 |
Cold inlay powder (LYS-A) 1000g/bottle, curing agent (LYS-B) 800ml/bottle, Ф30 cold inlay mold 1, 1 syringe, 20 plastic cups, 40 stirring rods, 1 spoon |
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Epoxy system |
HSK-A/B |
The product is transparent and cures quickly. It is suitable for the inlay of samples that cannot be heated or without micro-slice samples in electronic places such as inlays, PCBs, and SMT. Curing time: 25 ° C 40 minutes Use ratio: Resin 2: Curing agent 1 |
Epoxy King (HSK-A) 1000ml, curing agent (HSK-B) 500ml, Ф30 cold inlay mold, 1 syringe, 20 plastic cups, 40 stirring rods |
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HSN-A/B |
The product is highly transparent, small in shrinkage, low in viscosity and good in permeability. It is suitable for the inlay of samples that cannot be heated or without micro-slice samples in electronic places such as inlays, PCBs, and SMT. Curing time: 25 ° C 3 ~ 4 hours. Use ratio: Resin 2: Curing agent 1 |
Epoxy King (HSN-A) 1000ml, curing agent (HSN-B) 500ml, Ф30 cold inlay mold, 1 syringe, 20 plastic cups, 40 stirring rods |
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Accessories for mounting |
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Cold mosaic soft mold |
Φ20、Φ25、Φ30、Φ40 |
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Φ50 |
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25x17x35 55x20x22 |
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Φ25、Φ32mm |
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Release agent |
1L/bottle |
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Stainless steel slice clip |
100 pieces / bag |
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PET slice clip |
100 pieces / bag |
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